Electronics
Advanced Materials for Electronics Applications
Consumer electronics (CE) encompass communication, entertainment, and information devices. This industry’s continuous growth and innovation reinforce its significant role in the technology landscape, enhancing existing devices and introducing groundbreaking products. Today, CE represents a multibillion-dollar industry, providing a wide range of interconnected devices and services.
Polymeric materials, including thermosets and thermoplastics, are widely utilized in the construction of electronic components for EVs, AI, high-frequency telecommunications, and consumer electronics due to their design flexibility and excellent electrical insulation properties. However, their inherently low thermal conductivity poses a significant barrier to their broader use in thermal management applications.
For package- and board-level thermal management, the combination of higher thermal conductivities and smaller bond line thicknesses in dielectric layers results in lower thermal resistance. As voltages rise in power electronics, such as electric vehicles (EVs), maximizing electrical isolation in these thin dielectric layers becomes critical. Boron nitride exhibits one of the highest breakdown strengths (Eb) among fillers, allowing for reduced bond line thicknesses compared to other materials. The breakdown strength of a filled system can be equivalent to or even greater than that of the neat resin, and it performs comparably to a spherical alumina-filled system at the same volume loadings.
榴莲视频下载污黄 offers a range of high-performance ceramic fillers. Compounded into various polymeric materials, MT’s thermally conductive yet electrically insulating ceramic fillers enhance heat dissipation, extending the service life and improving the reliability of electronic components and assemblies.
Products Used in Electronics
Boron Nitride Powders
Hexagonal boron nitride possesses the highest thermal conductivity and excellent electrical insulating properties. These characteristics and low dielectric loss make boron nitride a highly sought-after filler in epoxies, silicons, and polyurethane (PU) systems. Additionally, the inherent softness of BN as a filler ensures good contact between the component, heat sink, and thermal interface material (TIM), thereby minimizing contact resistance.?
Spherical Alumina Powders
Spherical alumina powders are essential in the manufacturing of thermal management products that help regulate the temperature of electronic systems and devices. One common application is in thermally conducting plastics, which are created by adding conductive fillers to polymers during a compounding process. These materials are used in various electrical and electronic components, including mounting devices, heat sinks, and cooling systems.
