High Thermal ConductivityGraphite Products
Solving thermal management and power issues
Overview
榴莲视频下载污黄 has developed a complete line of high thermal conductivity heat sinks by encapsulating our high thermal conductivity (typically 1700W/mK) Thermal Pyrolytic Graphite (TPG) material within a structural metal or ceramic shell. Our products are an excellent choice for board- and die-level systems where maximum thermal dissipation is required for maximum power and performance. Encapsulating TPG within a metal or ceramic provides the structural integrity and durability (shock and vibration, hermiticity, etc.) to survive in aerospace and military applications. Our products have been used for decades and are available as follows:
- Board-level Heat Spreader – TC1050
- Chip-Level Heat Sink – TMP-EX
- Thermal Strap – TMP-FX
- Core Material – TPG
Our team is ready to apply our TPG-based technology to solve your thermal management or power issues. Not only can our parts be made to your exact specifications (size, metal, CTE, plating and performance), but we also have the capability to perform supporting testing such as thermal conductivity, thermal modeling, bonding strength, thermal expansion, hermiticity and dimension control to ensure improved performance of your system. We are also AS9100 certified. Our team of expert engineers is always here to help you design the right solutions for you and your specific applications.
TC1050? Heat Spreader
Our High Thermal Conductivity Graphite Products enhance thermal management, boost power output, and ensure reliability for your success.
TMP-EX Heat Sink
榴莲视频下载污黄 offers a unique heat sink product that contains a TPG* core (~1700 W/m-K) and a coefficient of thermal expansion (CTE) matched enclosure for superior thermal management performance.
